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VIA’s IoT module built on Snapdragon platform

November 7, 2017  - By

VIA Technologies has launched of the VIA SOM-9X20 system-on-module (SoM) powered by the Qualcomm Snapdragon 820 embedded platform.

The VIA SOM-9X20 module

The VIA SOM-9X20 is designed to make the power of Snapdragon available in an ultra-compact SoM that will help developers quickly create new commercial internet of things (IoT) systems, scenarios and use cases.

The VIA SOM-9X20 is an ultra-compact SoM that harnesses the performance and low power consumption of the Snapdragon 820 embedded platform to provide a flexible solution for enabling the rapid development of a variety of enterprise IoT and embedded system applications ranging from human-machine interface, surveillance and digital signage to robotics, cameras and video conferencing, the company said.

The module provides a full set of advanced wireless connectivity features including GPS.

“Combining cutting-edge computing, graphics, and video capabilities with advanced wireless connectivity and low power consumption, the Snapdragon 820 meets the exacting performance and power efficiency requirements of next-generation Enterprise IoT and embedded devices,” said Richard Brown, vice president of international marketing, VIA Technologies. “The VIA SOM-9X20 is designed to enable our customers to accelerate the development of groundbreaking new products with stunning 4K video capabilities for rapidly emerging applications such as machine intelligence, computer vision, and augmented and virtual reality.”

“The Snapdragon 820 embedded platform provides the performance, energy efficiency, and connectivity required in cutting-edge Enterprise IoT devices,” said Jeffery Torrance, vice president, business development, Qualcomm Technologies. “We are delighted that VIA is making the power of Snapdragon available in an ultra-compact SoM that will help developers quickly create new and exciting commercial IoT systems, scenarios, and use cases.”

The VIA SOM-9X20 module measures 8.2 x 4.5 centimeters and features 64-GB eMMC Flash memory and 4-GB LPDDR4 SDRAM on board. It offers rich I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI and multi-function pins for UART, I2C, SPI and GPIO.

The module also provides a full set of advanced wireless connectivity features including GPS, BT 4.1 and Wi-Fi 802.11 a/b/g/n/ac through an integrated combo module featuring two antenna connectors. A multi-I/O evaluation carrier board is available to accelerate system development. Customers can also utilize VIA’s extensive technical support and design assistance services to develop a custom baseboard.

The VIA SOM-9X20 comes with a BSP that features Android 7.1.1 as well as the VIA Smart Embedded Tool Kit comprising a number of APIs, including Watchdog Timer for safeguarding against system crashes, GPIO access, RTC for auto-power on and a sample app.

A full set of hardware and software customization services that speed up time to commercialization and minimize development costs is available. A full turnkey development service can also be provided for interested customers.

About the Author: Tracy Cozzens

Senior Editor Tracy Cozzens joined GPS World magazine in 2006. She also is editor of GPS World’s newsletters and the sister website Geospatial Solutions. She has worked in government, for non-profits, and in corporate communications, editing a variety of publications for audiences ranging from federal government contractors to teachers.