MediaTek’s newest 5G chipset ready for mass-market 5G phones

Photo: MediaTek

MediaTek’s Dimensity 700 5G smartphone chipset is a system on chip (SoC) designed to bring advanced 5G capabilities and experiences to the mass market.

The Dimensity 700 joins MediaTek’s Dimensity family of 5G chips, which is designed to give device makers a suite of options for 5G smartphone models. The chips range from flagship and premium to mid-range and mass market devices to make 5G more accessible for consumers everywhere.

GNSS signals received include GPS L1CA and L5, BeiDou B1I and B2, GLONASS L1OF, Galileo E1 and E5, QZSS L1C and L5, and NavIC.

“With our expanded Dimensity portfolio, we’re bringing the latest 5G capabilities to every smartphone tier so more people can enjoy 5G experiences,” said JC Hsu, corporate vice president and general manager of MediaTek’s Wireless Communications business unit. “The Dimensity 700 has an impressive mix of 5G connectivity features, advanced camera capabilities like night-shot enhancements, and multiple voice assistant support, all in a super power-efficient design.”

Advanced connectivity features include 5G carrier aggregation (2CC 5G-CA) and 5G dual-SIM dual-standby (DSDS), giving users access to the fastest speeds and 5G-exclusive Voice over New Radio (VoNR) services from either connection, the company said.

On the processing power side, the chip integrates two Arm Cortex-A76 big cores in its octa-core CPU and operates at up to 2.2GHz.

MediaTek’s Dimensity 5G family of chips are designed for 5G devices across all tiers, and with the Dimensity 700 5G devices will now be accessible to even more consumers.

For full specifications and further details on MediaTek’s Dimensity 700 series and 5G portfolio are on the MediaTek website.